Brute Hydrazine
Vapor-phase Surface Cleaning of Electroplated Cu Films Using Anhydrous N2H4
Author(s): Su Min Hwang, Luis Fabißn Pe±a, Kui Tan, Harrison Sejoon Kim, Aswin L. N. Kondusamy, Zhiyang Qin, Yong Chan Jung, Jean-Francois Veyan, Daniel Alvarez, Jeff Spiegelman, and Jiyoung Kim
Low Temperature ALD of SiNx using Si2Cl6 and ultra high-purity Hydrazine
Author(s): Aswin L.N. Kondusamy, Antonio T. Lucero, Su Min Hwang, Xin Meng, Harrison S. Kim, Jaebeom Lee, Dan Alvarez Jr., Jeff Spiegelman, Jiyoung Kim
Low Temperature Atomic Layer Deposition of Silicon Nitride using Hexachlorodisilane and Ultra-High Purity Hydrazine
Author(s): Aswin L. N. Kondusamy, Antonio T. Lucero, Su Min Hwang, Xin Meng, Harrison S. Kim, Dan Alvarez Jr., Jeff Spiegelman, and Jiyoung Kim
Low-T Thermal ALD BN from N2H4 + BCI3 on SI0.7Ge0.3(001), HPOG, and Cu
Author(s): Steven Wolf, M. Breeden, M. Edmonds, K
Low temperature thermal SiNx ALD process using N2H4
Author(s): Jae Chan Park, Dae Hyun Kim, Tae Jun Seok, Dae Woong Kim, Woo-Hee Kim and Tae Joo Park
Low Temperature Thermal ALD TiNx and TaNx Films from Anhydrous N2H4
Author(s): Steven Wolf, Michael Breeden, Mahmut Kavrik, Jun Hong Park, Russell Holmes, Daniel Alvarez, Jeffrey Spiegelman, and Andrew C. Kummel
Low temperature thermal ALD of a SiNx interfacial diffusion barrier and interface passivation layer on SixGe1- x(001) and SixGe1- x(110)
Author(s): Mary Edmonds, Kasra Sardashti, Steven Wolf, Evgueni Chagarov, Max Clemons, Tyler Kent, Jun Hong Park, Kechao Tang, Paul C. McIntyre, Naomi Yoshida, Lin Dong, Russell Holmes, Daniel Alvarez, and Andrew C. Kummel
BRUTE Hydrazine for Low Temperature Metal-Nitride ALD: Low Resistivity and Oxygen-Free Films Enabled by Ultra-High Purity
Author(s): Daniel Alvarez and Jeffrey Spiegelman
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