Author(s): Jin-Hyun Kim,a,b Sang Woo Kim, Su Min Hwang, Harrison Sejoon Kim, Yong Chan Jung, Luis Fabißn Pe±a, Kui Tan, Jean-Francois Veyan, Rino Choi, Daniel Alvarez, Jeff Spiegelman, and Jiyoung Kim

Products
Brute Hydrazine

Applications
Area Selective Atomic Layer Deposition (ASD), Surface Clean / Modification

Films
Co, Cu

Co

Selective Co metal ALD on Cu with Cyclic Hydrogen Peroxide and Hydrazine clean enables improved yield for Inverse Hybrid Metal Bonding application

Selective Co ALD for Chiplet-to-Wafer and Wafer to Wafer Bonding

Effect of Vapor-phase Cleaning Using Anhydrous N2H4 on Cu and Co for Area-Selective Atomic Layer Deposition

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