Co
Jun 2024
Selective Co ALD for Chiplet-to-Wafer and Wafer to Wafer Bonding
Author(s): IITC Interconnect 2024 (San Jose)
Products
BRUTE Hydrazine, BRUTE Peroxide
Applications
ALD (Oxide/Nitride), Surface Clean / Modification
Jun 2020
Effect of Vapor-phase Cleaning Using Anhydrous N2H4 on Cu and Co for Area-Selective Atomic Layer Deposition
Author(s): Jin-Hyun Kim,a,b Sang Woo Kim, Su Min Hwang, Harrison Sejoon Kim, Yong Chan Jung, Luis Fabißn Pe±a, Kui Tan, Jean-Francois Veyan, Rino Choi, Daniel Alvarez, Jeff Spiegelman, and Jiyoung Kim
Products
BRUTE Hydrazine
Applications
Area Selective Atomic Layer Deposition (ASD), Surface Clean / Modification