Low temperature ALD of SiNx in trench structure: Comparing hollow cathode plasma-enhanced ALD and thermal ALD with hydrazine

Aswin L.N. Kondusamy, Su Min Hwang, Zhiyang Qin, Antonio T. Lucero, Xin Meng, Harrison S. Kim, Jaebeom Lee, Dan Alvarez Jr., Jeff Spiegelman, Jiyoung Kim

Back to all Resources

June 2019

Get the full research report

Enter your email to request the full PDF of this report.

This field is for validation purposes and should be left unchanged.

Products:

Applications:

Films: