In this work by the Kummel Lab at UCSD nanometer scale conformal coatings of TiN and GaN were grown on SiO2 horizontal via test structures with Brute® Hydrazine (N2H4). The fabricated films were free of particles and pinholes with <0.1nm surface roughness. TEM-EDX analysis shows highly conformal coatings down to 4.5nm, making this technology attractive for 3D DRAM and NAND applications as dimensions are downscaled. Resistivity measurements show 119 µΩ cm films at 15 nm thickness when deposited at 500 °C.
