More reactive than water vapor or ozone
High Concentration Hydrogen Peroxide Gas
Hydrogen peroxide gas as a process reactant enables unique reaction pathways compared to conventional oxidants, delivering high reactivity while minimizing interface damage relative to ozone and oxygen plasma.
BRUTE Peroxide delivers high concentrations of Hydrogen Peroxide (H2O2) gas to the process chamber. An ampoule of BRUTE Peroxide contains anhydrous hydrogen peroxide absorbed onto a proprietary solid substrate, enabling high purity, stable delivery of H2O2 gas with low water content. BRUTE Peroxide is compatible with both carrier gas and vacuum draw, making it easy to adapt to any process.
Benefits of BRUTE Peroxide
- Differentiates between H2O2 and water in process reactions
- Reacts faster and at lower temperatures than water
- Removes carbon and hydroxylates interface surfaces
- Improves compatibility with metal surfaces—less aggressive oxidant than ozone or O2 Plasma
- Superior penetration into 3D high aspect ratio microstructures
- Allows high concentration H2O2 delivery into vacuum and low pressure applications
- Increases interface hydroxyl density on Si, Ge and SiGe films
- Enables in situ cleaning without liquid
- Proprietary delivery process, ensuring higher purity
BRUTE Peroxide Beats Traditional Vaporizers and Passivation Technology
- BRUTE Peroxide delivers high concentration H2O2 gas. No other commercial technology can deliver ultra-dry hydrogen peroxide gas.
- A thermodynamically stable, thin, uniform, high quality interlayer dielectric results.
- Plasma technology requires line of sight not possible in high aspect ratio devices.
- Ozone gas can burn and damage surfaces.
- Bubblers deliver less than 1% hydrogen peroxide gas by volume.
- Flash vaporizers create hydrogen peroxide droplets that lead to particle formation on surfaces annealing at 300C.