Area Selective Atomic Layer Deposition (ASD)

Apr 2024

Inhibitor Free Area Selective Atomic Layer Deposition (AS-ALD) of dielectric materials on Cu surface for Interconnect applications

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Apr 2024

Vapor Phase surface cleaning of Cobalt for novel interconnect applications

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Jun 2020

Effect of Vapor-phase Cleaning Using Anhydrous N2H4 on Cu and Co for Area-Selective Atomic Layer Deposition

Author(s): Jin-Hyun Kim,a,b Sang Woo Kim, Su Min Hwang, Harrison Sejoon Kim, Yong Chan Jung, Luis Fabißn Pe±a, Kui Tan, Jean-Francois Veyan, Rino Choi, Daniel Alvarez, Jeff Spiegelman, and Jiyoung Kim

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